Wire-bond Packaging Studies for Copper/Low-K Semiconductor Devices

Date Issued

2002-07-31

Date

2002-07-31

Author(s)

吳恩柏

DOI

902212E002157

URI

http://ntur.lib.ntu.edu.tw//handle/246246/21636

Publisher

臺北市：國立臺灣大學應用力學研究所

Type

report

File(s)

Name

902212E002157.pdf

Size

551.97 KB

Format

Adobe PDF

Checksum

(MD5):48872846cf56d88916987ffe91578a6e