Reaction of solder with Ni/Au metallization for electronic packages during reflow soldering

Journal

IEEE Transactions on Advanced Packaging

Journal Volume

24

Journal Issue

4

Pages

493-498

Date Issued

2001

Author(s)

Ho C.E.

Tsai S.Y.

DOI

10.1109/6040.982835

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-0035521102&doi=10.1109%2f6040.982835&partnerID=40&md5=e1189f7c696736ac810676b5a3e759ce

https://scholars.lib.ntu.edu.tw/handle/123456789/432739

Type

journal article