Hybrid thermal solution for 3D-ICs: Using thermal TSVs with placement algorithm for stress relieving structures

Journal

Electronic Components and Technology Conference

Pages

1455-1460

Date Issued

2012

Author(s)

Chien, J.-H.

Yu, H.

Tsai, N.-Y.

Lung, C.-L.

Hsu, C.-C.

Chou, Y.-F.

Chen, P.-H.

Chang, S.-C.

DOI

10.1109/ECTC.2012.6249028

URI

http://www.scopus.com/inward/record.url?eid=2-s2.0-84866856641&partnerID=MN8TOARS

http://scholars.lib.ntu.edu.tw/handle/123456789/370770

SDGs

[SDGs]SDG7

Type

journal article