Efficient thermal simulation for 3-D IC with thermal through-silicon vias

Journal

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

Journal Volume

31

Journal Issue

11

Pages

1767-1771

Date Issued

2012

Author(s)

Oh, D.

Chen, C.C.P.

Hu, Y.H.

CHUNG-PING CHEN

DOI

10.1109/TCAD.2012.2196435

URI

https://scholars.lib.ntu.edu.tw/handle/123456789/501064

URL

https://www.scopus.com/inward/record.uri?eid=2-s2.0-84867833985&doi=10.1109%2fTCAD.2012.2196435&partnerID=40&md5=43669e1948f8f85db68423664f349239

Type

journal article