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College of Engineering / 工學院
Mechanical Engineering / 機械工程學系
Does the Residual Stress of Backend Grinding Dominate the Warping Problems in Wafer Thinning Process
Details
Does the Residual Stress of Backend Grinding Dominate the Warping Problems in Wafer Thinning Process
Date Issued
2010
Author(s)
Chen, K.R.
Young, H.T.
HONG-TSU YOUNG
URI
https://scholars.lib.ntu.edu.tw/handle/123456789/587666
Type
journal article
