Thermal modeling for 3D-ICs with integrated microchannel cooling.

Journal

2009 International Conference on Computer-Aided Design, ICCAD 2009, San Jose, CA, USA, November 2-5, 2009

Pages

256-263

Date Issued

2009

Author(s)

Mizunuma, Hitoshi

Yang, Chia-Lin

DOI

URI

URL

Type

conference paper