A fully SiP integrated V-band butler matrix end-fire beam-switching transmitter using flip-chip assembled CMOS chips on LTCC
Journal
IEEE Transactions on Microwave Theory and Techniques
Journal Volume
60
Journal Issue
5
Pages
1424-1436
Date Issued
2012
Author(s)
Abstract
In this paper, a fully system-in-package (SiP) integrated V -band Butler matrix beam-switching transmitter (TX) is presented. The CMOS chips from differential process technologies are assembled on a low-temperature co-fired ceramic (LTCC) substrate carrier by flip-chip interconnects. The vertically embedded folded monopole antenna is designed and integrated into the LTCC. The array consisting of four identical monopole antennas and a Butler matrix for beam switching is realized on the LTCC for loss reduction. Four switched main beams are measured and agree well with simulation. This beam-forming TX shows the potential of the low-cost millimeter-wave SiP with CMOS chips.
SDGs
Type
journal article