Intermetallic compounds formed during interfacial reactions between liquid Sn-8Zn-3Bi solders and Ni substrates
Journal
Journal of Electronic Materials
Journal Volume
31
Journal Issue
5
Pages
494-499
Date Issued
2002
Author(s)
Abstract
The morphology and growth kinetics of intermetallic compounds (IMCs) formed at the interfaces between liquid Sn-8Zn-3Bi solders and nickel substrates in the temperature range from 225°C to 400°C are investigated for the applications in bonding recycled sputtering targets to their backing plates. The results show that a continuous single layer of Ni5Zn21 IMC appears at temperatures below 325°C, while a double layer containing Ni5Zn21 and Ni35Zn22Sn43 IMCs is formed at temperatures above 325°C. In both cases, the growth kinetics of IMCs is interface-controlled. During the growth of IMCs, their reaction fronts migrate in the direction of the solder much more rapidly than toward the nickel substrate, and erosion of the Ni substrate is quite slight.
Type
journal article