Intermetallic compounds formed during interfacial reactions between liquid Sn-8Zn-3Bi solders and Ni substrates

Journal

Journal of Electronic Materials

Journal Volume

31

Journal Issue

5

Pages

494-499

Date Issued

2002

Author(s)

Chiu, M.Y.

Wang, S.S.

Chuang, T.H.

TUNG-HAN CHUANG

DOI

10.1007/s11664-002-0105-8

URI

https://scholars.lib.ntu.edu.tw/handle/123456789/492034

URL

https://www.scopus.com/inward/record.uri?eid=2-s2.0-0036575443&doi=10.1007%2fs11664-002-0105-8&partnerID=40&md5=89c46c3a0754c14b2facbef33e429b62

Type

journal article