Studies of the Twin Coherency on Electroless (111) Nanotwins
Journal
2025 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)
Part Of
2025 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2025
Start Page
113
End Page
114
Date Issued
2025-04-15
Author(s)
Abstract
Recently, additives-induced highly (111)-textured nanotwins in electroless deposition have revealed significant potential for applications in the electronics industry. This study aims to investigate the mechanical and electrical properties of the electroless deposited highly (111)-textured copper (Cu) that can be heavily influenced by the lattice arrangement within these nanotwins, specifically through twin coherency. Coherency in nanotwinned Cu is often determined by a specific lattice arrangement called Coincidence Site Lattice (CSL) grain boundaries. The degree of this alignment is represented by the Σ value, with a lower Σ value indicating a higher degree of coincidence, generally corresponding to lower energy and a more stable structure. In this study, two (111) textured electroless deposited nanotwinned Cu films with varying proportions of Σ 3 111 coherent twin boundaries were fabricated. Various tests, including cross-sectional observation, electron backscatter diffraction analysis, nanoindentation, and electrical resistivity, were conducted to assess the impact of twin coherency on this engineering material.
Event(s)
24th International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2025, Nagano, 15 April 2025 through 19 April 2025. Code 209021
Subjects
Electroless plating
Nanotwinned Cu
Preferred orientation
Twin coherency
Publisher
IEEE
Type
conference paper