Precision Wafer Thinning and Its Surface Conditioning Technique
Resource
International Journal of Materials Product Technology,31,36-45.
Journal
International Journal of Materials Product Technology
Journal Issue
31
Pages
36-45
Date Issued
2006-07
Date
2006-07
Author(s)
Young, H.T.
Lin, C.C.
Liao, H.T.
Type
journal article