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College of Electrical Engineering and Computer Science / 電機資訊學院
Electronics Engineering / 電子工程學研究所
3D Thermal-ADI: An Efficient Chip-Level Transient Thermal Simulator
Details
3D Thermal-ADI: An Efficient Chip-Level Transient Thermal Simulator
Journal
ACM International Symposium on Physical Design (ISPD)
Date Issued
2003-04
Author(s)
Ting-Yuan Wang
Yu-Min Lee
CHUNG-PING CHEN
URI
http://scholars.lib.ntu.edu.tw/handle/123456789/304385
Type
conference paper
