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College of Electrical Engineering and Computer Science / 電機資訊學院
Electrical Engineering / 電機工程學系
Inductance computations for three dimensional packaging structures
Details
Inductance computations for three dimensional packaging structures
Journal
Electronics, Devices, and Manufacturing, edms'89
Date Issued
1989-09
Author(s)
C. N. Kuo
R. B. Wu
K. K. Chang
RUEY-BEEI WU
URI
http://scholars.lib.ntu.edu.tw/handle/123456789/351845
Type
conference paper