Twinning mechanism at three-grain tri-junction during directional solidification of multi-crystalline silicon

Journal

Acta Materialia

Journal Volume

144

Pages

41-50

Date Issued

2018

Author(s)

Jain, T.

Lin, H.K.

Lan, C.W.

DOI

10.1016/j.actamat.2017.10.042

URI

https://scholars.lib.ntu.edu.tw/handle/123456789/444831

URL

https://www.scopus.com/inward/record.uri?eid=2-s2.0-85032275484&doi=10.1016%2fj.actamat.2017.10.042&partnerID=40&md5=951056ad492537378d0f5d3cdc3f47d1

Type

journal article