Effects of Joining Sequence on the Interfacial Reactions and Substrate Dissolution Behaviors in Ni/Solder/Cu Joints

Resource

Journal of electronic materials, 40(9), 1912-1920

Journal

Journal of electronic materials

Journal Volume

40

Journal Issue

9

Pages

1912-1920

Date Issued

2011

Date

2011

Author(s)

Liu, Chao Sheng

Ho, Cheng En

Peng, Cheng Sam

DOI

URI

Type

journal article

File(s)

Name

145.pdf

Size

23.41 KB

Format

Adobe PDF

Checksum

(MD5):c3fb1cf5cf695d9aa47b9f7d37bb3e48