Effects of Joining Sequence on the Interfacial Reactions and Substrate Dissolution Behaviors in Ni/Solder/Cu Joints
Resource
Journal of electronic materials, 40(9), 1912-1920
Journal
Journal of electronic materials
Journal Volume
40
Journal Issue
9
Pages
1912-1920
Date Issued
2011
Date
2011
Author(s)
Abstract
The effects of the joining sequence on the interfacial reactions and substrate dissolution behaviors in Ni/solder/Cu joints were studied by using 500-μm (diameter) Sn-3.5Ag solder balls and substrates with a 375-μm (diameter) opening. Three distinct paths for the joining sequence were studied. In path I, a solder ball was first joined to the Cu substrate and then to the Ni substrate. In path II, a solder ball was joined to both the Cu and Ni substrates simultaneously. Path III had the opposite joining sequence to path I. The results of this study indicated that (Cu,Ni) 6Sn 5 was the predominant reaction product at both the Ni/solder and solder/Cu interfaces regardless of the joining sequence. However, the composition, morphology, and thickness of the (Cu,Ni) 6Sn 5 varied considerably with the different paths. The dissolution behaviors of Cu and Ni were also different. Dybkov's dissolution kinetics and Cu-Ni-Sn isotherm data were utilized to rationalize these differences. © 2011 TMS.
Type
journal article
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