Two Phase Close Loop Thermosyphon Cooling System
Date Issued
2005
Date
2005
Author(s)
Hsiao, Wei-Che
DOI
zh-TW
Abstract
With the development of electronic industry, electronic components keep going for high performance and small volume. Since the heat in unit area is getting higher and higher, the problem of cooling appears. In early days, people solve these problems with fins and fans, but this method won’t work for the electronic components of next generation. So we have to solve the problem of cooling the electronic components of next generation in other ways.
In the research, we studied the performance of Two Phase Close Loop Thermosyphon Cooling System under different parameter with water as working fluid. There are evaporator, condenser, and adiabatic section in the system. The working fluid in the evaporator absorbs the heat from the electronic components and changes its phase to vapor by the mechanism of evaporation or boiling. Then the vapor goes through adiabatic section to the condenser to release the heat and condense. There are three enhanced surfaces-grooved surface, etched surface, and sintered surface with vertical condenser for the system. We studied the performance of these three surfaces under different filling ratio and power. Then compared the performance of condenser with Chang’s[29]. In the research, it was found that the total thermal resistance, evaporator thermal resistance, and condenser thermal resistance are all going down with the increasing power. It says that the system is suitable for cooling the electronic components of next generation. And we also found that because of thin film evaporation, the system will have the best performance at 15% filling ratio with sintered surface.
Subjects
熱虹吸
強化沸騰表面
薄膜蒸發
Thermosyphon
Boiling Enhancement
Film Evaporation.
Type
thesis
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