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College of Electrical Engineering and Computer Science / 電機資訊學院
Electrical Engineering / 電機工程學系
Electrical Analysis and Simulation for MLC Packaging
Details
Electrical Analysis and Simulation for MLC Packaging
Journal
SEMI Taiwan Technical Symposium
Pages
31-40
Date Issued
1993
Author(s)
Wu, Ruey-Beei
URI
http://scholars.lib.ntu.edu.tw/handle/123456789/304059
Type
conference paper