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College of Engineering / 工學院
Materials Science and Engineering / 材料科學與工程學系
Effects of Ag concentration on the Ni-Sn interfacial reaction for 3D-IC applications
Details
Effects of Ag concentration on the Ni-Sn interfacial reaction for 3D-IC applications
Journal
International Symposium on Advanced Packaging Materials
Pages
113-120
Date Issued
2013
Author(s)
Yu J.J.
Chung C.K.
Yang S.
C. ROBERT KAO
DOI
10.1109/ISAPM.2013.6510394
URI
https://www.scopus.com/inward/record.uri?eid=2-s2.0-84878865419&doi=10.1109%2fISAPM.2013.6510394&partnerID=40&md5=82f37ac1c5f6e042e1a82b1ead23a134
https://scholars.lib.ntu.edu.tw/handle/123456789/432627
Type
conference paper
