Considerations of SiP based Antenna in Package/Module (AiP/AiM) Design at Sub-Terahertz Frequencies for Potential B5G/6G Applications
Journal
Proceedings - Electronic Components and Technology Conference
Journal Volume
2021-June
Pages
1162-1168
Date Issued
2021
Author(s)
Abstract
Antenna-in-Package/Module (AiP/AiM) are the primary technologies to realize the RF subsystems for frequencies beyond millimeter-wave (mmW) bands, including sub-terahertz for potential B5G/6G applications. Due to the small wavelength, the mechanical process of the current system-in-package (SiP) results in limitations to realize antenna arrays at sub-terahertz. In this paper, the mechanical limits to cause radiation discrepancy is investigated by designing an AiP/AiM at 110 GHz band. Through the parametric studies based on the currently available cheap SiP process, one may summarize the considerations of AiP/AiM design for beyond sub-terahertz frequencies. The examination will consider the design of an 8x8 antenna array to provide a radiation gain of 20 dBi. Numerical full-wave simulations by HFSS were performed to obtain reliable behaviors of AiP/AiM radiations. © 2021 IEEE
Subjects
Active antenna; Antenna array; Antenna-in-module; Antenna-in-package; B5G/6G mobile communication; Sub-Terahertz frequencies
SDGs
Other Subjects
Antenna arrays; Microwave antennas; Millimeter waves; Silicon compounds; Terahertz waves; Active antennas; Antenna in packages; Antenna-in-module; B5G/6g mobile communication; Mobile communications; Primary technologies; Sub-terahertz; Sub-terahertz frequency; Systems in packages; Terahertz frequencies; System-in-package
Type
conference paper