Novel method to investigate the critical depth of cut of ground silicon wafer

Journal

Journal of Materials Processing Technology

Journal Volume

182

Journal Issue

1-3

Pages

157-162

Date Issued

2007

Author(s)

Young, H.T.

Liao, H.-T.

Huang, H.-Y.

DOI

10.1016/j.jmatprotec.2006.07.025

URI

http://www.scopus.com/inward/record.url?eid=2-s2.0-33750634167&partnerID=MN8TOARS

http://scholars.lib.ntu.edu.tw/handle/123456789/330561

Type

journal article