Skip to main content
English
中文
Log In
Log in
Log in with ORCID
NTU Single Sign On
Have you forgotten your password?
Home
College of Electrical Engineering and Computer Science / 電機資訊學院
Electrical Engineering / 電機工程學系
Overview of power integrity solutions on package and PCB: decoupling and EBG isolation
Details
Overview of power integrity solutions on package and PCB: decoupling and EBG isolation
Journal
IEEE Transactions on Electromagnetic Compatibility
Journal Volume
52
Journal Issue
2
Pages
346-356
Date Issued
2010-05
Author(s)
T.-L. Wu
H.-H. Chuang
T.-K. Wang
Wu, Tzong-Lin
DOI
10.1109/TEMC.2009.2039575
URI
http://scholars.lib.ntu.edu.tw/handle/123456789/359405
SDGs
[SDGs]SDG7
Type
journal article
