Wireless power transmission system between stacked dies
Date Issued
2011
Date
2011
Author(s)
Ji, Jun-An
Abstract
A wireless power transmission for stacked dies in 3D-IC is implemented by using coupled inductor design. There are three common methods for wirelessly power transfer: inductive coupling, capacitive coupling and antenna radiation. We hope the wireless power transmission system can offer more than mW power. Unfortunately, only inductive coupling can provide over mW power transmission. Besides, inductive coupling interconnect has longer transmission distance as compared with capacitive interconnect and antenna. This is why we choose inductive coupling. In this thesis, we implement two systems in different transmission distances. The transmission distance is 15μm and 70μm respectively. A sine-wave signal generator is adopted as a source for power transmission. On the other side, there is a receiving inductor and a rectifier at the receiver. The proposed receiver of wireless power transmission system is implemented in TSMC 0.18μm CMOS process and the transmitter of wireless power transmission system is implemented in Al2O3 process and GIPD process respectively for demonstration of this architecture. The simulated received power and efficiency for transmitting inductor using Al2O3 process are 38.10mW and 25.93% respectively. The measured received power and efficiency for transmitting inductor using GIPD process are 3.28mW and 10.36% respectively.
Subjects
3D-IC
coupled inductor
power transmission
flip-chip
rectifier
Type
thesis
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ntu-100-R98943129-1.pdf
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