A low-loss balun-embedded interconnect for THz heterogeneous system integration
Journal
International Microwave Symposium
Pages
1043-1046
Date Issued
2020
Author(s)
Abstract
An interconnect for THz heterogeneous integration is proposed in this work. Two transmission lines deployed on a 40-nm CMOS chip and an IPD carrier, respectively, are coupled together to form a Marchand balun during a flip-chip packaging process. By doing this, the proposed interconnect can provide packaging and balun functions simultaneously. Two interconnects using the proposed idea are demonstrated with measured and simulated insertion loss of 0.9 and 1.4 dB at 169 and 340 GHz, respectively. © 2020 IEEE.
Subjects
Heterogeneous integration; Interconnect; Low-loss; Marchand balun; THz
Other Subjects
Chip scale packages; CMOS chips; Flip-chip packaging; Heterogeneous integration; Heterogeneous systems; Low-loss; Marchand balun; Integrated circuit interconnects
Type
conference paper