The Process Development of Suspended High-Aspect-Ratio Micro-Structures and the Application for MEMS Optical Fiber-to-Fiber Switches
Date Issued
2006
Date
2006
Author(s)
Kuo, Wen-Cheng
DOI
zh-TW
Abstract
This work is devoted to the development the processes for single or double layers device of high-aspect-ratio suspended structures and the application for MEMS optical fiber-to-fiber optical switches. In the development of single layer high-aspect-ratio suspended structures, we proposed the single-run single-mask process for the small opening of high-aspect-ratio suspended structures. The maximum device thickness is 120μm and maximum trench aspect ratio is 28:1. Except for SOI process, SRM process can offer the best manufacturing capacity. For larger opening of high-aspect-ratio suspended structures, by enhancing the microtrenching effect, we modified the SRM process and achieved the maximum device thickness of 100μm and maximum trench aspect ratio of 20:1. Besides, we also study the SOI and non-SOI processes for two layer thickness of high-aspect-ratio suspended structures, offering the total solution for manufacturing.
In the design and fabrication of MEMS optical fiber switches, we proposed the optimized dimensions for various type of optical switches by the simulation of Coventorware. By using the proposed two layer thicknesses of SOI manufacturing technology, we can fabricate 1X2 and 1X4 optical fiber-to-fiber switches. The optimized insertion loss is 0.9dB for 1X2 type and 5.6dB for 1X4 type.
Subjects
感應耦合電漿蝕刻
結構懸浮製程
光纖切換
梳狀致動器
擋塊
折疊式撓性機構
SOI晶圓
inductively coupled plasma etching
high-aspect-ratio structure
structure releasing
optical switching
comb drive
stopper
folded beams
SOI wafer
Type
thesis
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