Singular uniformity after reflow of varied-shaped flip chip solder bump on single substrate

Journal

2006 International Conference on Electronic Materials and Packaging

Pages

-

Date Issued

2006

Author(s)

Hsu, H.-J.

Huang, J.-T.

Chao, P.-S.

Wu, C.-S.

Shih, S.-H.

Yang, S.-Y.

DOI

10.1109/EMAP.2006.4430608

URI

https://scholars.lib.ntu.edu.tw/handle/123456789/448193

URL

https://www.scopus.com/inward/record.uri?eid=2-s2.0-51449119833&doi=10.1109%2fEMAP.2006.4430608&partnerID=40&md5=064153e9b24dea55e0fb9d3bb69daf7a

Type

conference paper