Intermetallic Reactions in a Sn-51In Solder BGA Package with immersion Ag Surface Finish

Resource

Journal of the Chinese Institute of Engineers, In Press

Journal

Journal of the Chinese Institute of Engineers

Pages

-

Date Issued

2008

Date

2008

Author(s)

Jain, Chao-Chi

Wang, Shiuan-Sheng

Wu, Hui-Min

URI

Type

journal article

File(s)

Name

116.pdf

Size

1.13 MB

Format

Adobe PDF

Checksum

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