Bonding strength of pressurized microchannels fabricated by polydimethylsiloxane and silicon
Journal
Journal of Micromechanics and Microengineering
Journal Volume
20
Journal Issue
11
Date Issued
2010
Author(s)
Wu, Guan-Wei
Shih, Wen-Pin
Hui, Chung-Yuen
Chen, Sih-Li
Lee, Chi-Yuan
Wu, G.-W.
Shih, W.-P.
Hui, C.-Y.
Chen, S.-L.
Lee, C.-Y.
Abstract
A fracture mechanics approach is used to determine the critical fluid pressure needed to debond the interface ahead of a microchannel which is fabricated by wafer bonding techniques. The relation between the effective bonding energy of the wafer bonding interface and the critical pressure is given in closed form. Detailed finite element simulations are carried out to verify our analytical model. Our analysis shows that the energy release rate computed using beam theory can be considerably lower than the actual release rate. The critical pressure of polydimethylsiloxane (PDMS)/silicon microchannels was also determined by experiments. Using our analytical model, the effective bonding energy was obtained at different partial curing temperatures. For example, the maximum effective bonding energy is found to be 1.48 J m−2 at a curing temperature of 115 °C.
SDGs
Type
journal article