Thermal Management Schemes for 3D Network-On-Chip
Date Issued
2009
Date
2009
Author(s)
Wu, Jia-Cheng
Abstract
In this thesis, we focus on the thermal problems in 3D Network-on-Chips (NoC). As process scales down, the NoC becomes the popular architecture of on-chip communication in Chip MultiProcessors (CMP) platforms. With 3D IC techniques, 3D NoC can perform higher integrated density, higher network bandwidth, lower interconnection delay, and lower power consumption than 2D NoC. If the NoC is established in the environment of 3D ICs, the thermal problem is more serious than 2D NoC. Many dies stacked up in 3D ICs result in the problems of power density increasing drastically, and different heat dissipations in different layers. Besides, both heats of networks and heats of CPUs are the major reasons that cause temperatures increasing in 3D NoC. Hence, the heats from NoC cannot be ignored. Thermal management techniques in traditional 2D NoC cannot extend to 3D NoC directly. Therefore, thermal management schemes for 3D NoC are needed. In this thesis, a Spatial Thermal Distribution Balancing (STDB) traffic-aware downward routing algorithm is proposed which considers the thermal characteristic of 3D NoC, balances the spatial thermal distribution, and reduced temperature with less performance impact. Besides, a Temporal Thermal Distribution Balancing (TTDB) thermal-aware vertical throttling technique is proposed which monitors the network temperature, controls the traffic in hotspot router, forms the heat flow to heat sink, and prevents from overheating. Experiments show that under the normal thermal limit, the maximum network throughput using the STDB scheme can be improved by 12% than using the general XYZ routing. Besides, the TTDB scheme has the higher received packet rate comparing to the distributed throttling. Under the Markov-Modulated Process (MMP) traffic model, the available received packet rate is at least 60%. Therefore, for 3D NoC, the proposed techniques can reduce temperature with less performance impact in general condition and prevent overheating with less packet loss comparing to traditional techniques.
Subjects
NoC
3D IC
Thermal management scheme
Type
thesis
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