A fast in situ approach to estimating wafer warpage profile during thermal processing in microlithography

Resource

Measurement Science and Technology 17: 2233-2240

Journal

Measurement Science and Technology

Journal Volume

17

Journal Issue

8

Pages

2233-2240

Date Issued

2006-08

Author(s)

Ni Hu

Arthur Tay

Kuen-Yu Tsai

DOI

URI

Type

journal article

File(s)

Name

02.pdf

Size

717.67 KB

Format

Adobe PDF

Checksum

(MD5):22c7261118b3f278794b21d4bf2dadb0