Electromigration of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.5Ce-0.2Zn solder joints with Au/Ni(P)/Cu and Ag/Cu pads

Journal

Journal of Alloys and Compounds

Journal Volume

487

Journal Issue

1-2

Pages

458-465

Date Issued

2009

Author(s)

Lin, H.-J.

Lin, J.-S.

Chuang, T.-H.

TUNG-HAN CHUANG

DOI

10.1016/j.jallcom.2009.07.167

URI

https://scholars.lib.ntu.edu.tw/handle/123456789/491993

URL

https://www.scopus.com/inward/record.uri?eid=2-s2.0-70350618591&doi=10.1016%2fj.jallcom.2009.07.167&partnerID=40&md5=d62ae1dc9fedcf1c07e8ca612a4b0aa3

Type

journal article