Thermally isolated microstructures for sensors and actuators
Resource
Micro Machine and Human Science, 1995. MHS '95., Proceedings of the Sixth International Symposium on
Journal
Micro Machine and Human Science, 1995. MHS '95.
Pages
-
Date Issued
1995-10
Date
1995-10
Author(s)
Lin, Liwei
Chiao, Mu
Chu, Huey-Chi
DOI
N/A
Abstract
We have demonstrated the feasibility of thermal isolation by using suspended microstructures. Thermal insulation is provided by a suspension gap constructed by means of surface micromachining. Prototype line shape microstructures with a suspension gap of 2 /spl mu/m and length ranging from 10 to 100 /spl mu/m, width ranging from 1 to 10 /spl mu/m and thickness of 2 /spl mu/m have been fabricated and analyzed. Efficiencies of thermal isolation for these suspended microstructures are compared with two other microstructures, overhanging type made by bulk micromachining and attached type made by general IC process. The results show that suspended microstructures dissipate 80 times less heat than the attached type and 2 times more than the overhanging type microstructures when operated in air.
Type
other
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