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College of Engineering / 工學院
Mechanical Engineering / 機械工程學系
Improvement of Silicon Substrate Strength by an Application of Semiconductor Metallization Process
Details
Improvement of Silicon Substrate Strength by an Application of Semiconductor Metallization Process
Journal
International Manufacturing Conference in China (IMCC 2015)
Date Issued
2015
Author(s)
Chen, Y.J.
Tang, C.W
Young, H.T.
Gou M.H.
HONG-TSU YOUNG
URI
https://scholars.lib.ntu.edu.tw/handle/123456789/587663
Description
Hangzhou, China
Type
conference paper