Use of decomposable polymer-coated submicron Cu particles with effective additive for production of highly conductive Cu films at low sintering temperature
Journal
Journal of Materials Chemistry C
Journal Volume
5
Journal Issue
5
Pages
1033-1041
Date Issued
2017
Author(s)
Yong, Y.
Nguyen, M.T.
Yonezawa, T.
Asano, T.
Matsubara, M.
Tsukamoto, H.
Liao, Y.-C.
Zhang, T.
Isobe, S.
Nakagawa, Y.
Abstract
A method for producing Cu films with low resistivity, based on low temperature sintering, is demonstrated. The Cu inks for preparing conductive Cu films consisted of Cu particles that were coated with a decomposable polymer (poly(propylenecarbonate), PPC) as well as a self-reducible copper formate/1-amino-2-propanol (CuF-IPA) complex as an additive. The sintering temperature used in this study was as low as 100 °C. Following sintering at a temperature of 100 °C, the lowest reported resistivity (8.8 × 10−7 Ω m) was achieved through the use of Cu-based metal-organic decomposition (MOD) inks. This was due to the dual promotional effects of the aminolysis of PPC with IPA and the pyrolysis of the CuF-IPA complex.
Type
journal article