Development and application of micro transfer stamping technique
Date Issued
2008
Date
2008
Author(s)
Chan, Bin-Da
Abstract
The thesis develops a micro transfer stamping technique to fabricate microstructures. There are five advantages of the micro transfer stamping technique： 1. This is a simple process; 2. There is no residual layer, therefore no additional process is needed to remove the residual layer; 3. The process can fabricate muti-layer structure; 4. The process is theoretically suitable for all solution-processable materials; 5. No additional chemical process is needed in the process.here are five research topics in the thesis, includes development of lithography and etching process for metal materials, development of ITO etching process, stress and strain simulation of PDMS mold in the transfer stamping process, development of single-/ muti- layer transfer stamping process and application of the micro transfer stamping process.n the “development of lithography and etching process for metal materials” section, FeCl3 is used to etch metals including cooper and stainless steel, and the suitable process parameters are identified. In the “development of ITO etching process” section, optimization of four process factors of the ITO etching quality is carried out. In the section, we propose that with proper PR coating thickness and post expose baking time, the desired dimensions of ITO pattern can be reached. In the “stress and strain simulation of PDMS mold in the transfer stamping process” section, the simulation results show that the “gap” between microstructures of PDMS mold sags as the applied pressure is high enough or the gap length is large. A large sagging distance would lead to residual layer appearance in the transfer stamping process. It is found that increasing PDMS mold thickness can prevent residual layer forming. In the “development of single/ multi-layer transfer stamping process” section, the micro transfer stamping technique can effectively transfer the patterns of the mold onto substrate. With proper pressure and temperature, the PR “ink” can successfully be transferred on the PMMA substrate with no residual layer. The section also proves that the micro transfer stamping technique can transfer dual-layer patterns, including spot stacks and woven patterns. In the “application of the micro transfer stamping process” section, we show the application of micro transfer stamping technique. The single-layer transferred PR patterns can replace lithography process, to be directly used as the etching mask in the metal-etching process. We also prove that the micro-transfer stamping can transfer various materials, including doped conductive polymer, PEDOT:PSS and silver paste. This implies that the process has the potential to fabricate muti-layer organic field effect transistor (TFT).
Subjects
stamping
printing
NIL
muti-layer
OTFT
silver paste
Type
thesis
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