Size effect of rare-earth intermetallics in Sn-9Zn-0.5Ce and Sn-3Ag-0.5Cu-0.5Ce solders on the growth of tin whiskers

Journal

Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

Journal Volume

39

Journal Issue

12

Pages

2862-2866

Date Issued

2008

Author(s)

Chuang, T.H.

Lin, H.J.

DOI

URI

URL

Type

journal article