Development of an automated optical inspection system for rapidly and precisely measuring dimensions of embedded microchannel structures in transparent bonded chips

Journal

Sensors (Switzerland)

Journal Volume

21

Journal Issue

3

Pages

1��14��

Date Issued

2021

Author(s)

Chen P.-C.

Lin Y.-T.

Truong C.-M.

Chiang H.-K.

DOI

10.3390/s21030698

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-85099691727&doi=10.3390%2fs21030698&partnerID=40&md5=7ea798cdc4106aa77fb59ff74d9ac3e9

https://scholars.lib.ntu.edu.tw/handle/123456789/596776

Publisher

MDPI AG

Type

letter