Intermetallic compounds formed during diffusion soldering of Au/Cu/Al 2O3 and Cu/Ti/Si with Sn/In interlayer

Journal

Journal of Electronic Materials

Journal Volume

35

Journal Issue

7

Pages

1566-1570

Date Issued

2006

Author(s)

Chuang, T.-H.

Lin, H.-J.

Tsao, C.-W.

TUNG-HAN CHUANG

DOI

10.1007/s11664-006-0150-9

URI

https://scholars.lib.ntu.edu.tw/handle/123456789/492013

URL

https://www.scopus.com/inward/record.uri?eid=2-s2.0-33746925196&doi=10.1007%2fs11664-006-0150-9&partnerID=40&md5=2bc3c0dbbdf09e2cc0e0e0a16cd1c5df

Type

journal article