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College of Electrical Engineering and Computer Science / 電機資訊學院
Computer Science and Information Engineering / 資訊工程學系
Thermal modeling for 3D-ICs with integrated microchannel cooling
Details
Thermal modeling for 3D-ICs with integrated microchannel cooling
Journal
IEEE/ACM International Conference on Computer-Aided Design
Pages
256-263
Date Issued
2009
Author(s)
CHIA-LIN YANG
Mizunuma, H.
Yang, C.-L.
Lu, Y.-C.
CHIA-LIN YANG
URI
http://www.scopus.com/inward/record.url?eid=2-s2.0-76349112929&partnerID=MN8TOARS
http://scholars.lib.ntu.edu.tw/handle/123456789/349151
Type
conference paper
