Investigation of Flow Relaminarization and Transient Heat Transfer in a Rapid Thermal Processor
Date Issued
2002-07-31
Date
2002-07-31
Author(s)
翁宗賢
DOI
902212E002227
Abstract
This project investigated transient heat
transfer in a RPT. A thermal model was
built which can simulate rapid thermal processing
up to 8-inch wafer. Temperature
distribution of the wafer can be deduced from
infrared images acquired through a backside
window. Numerical computations also carried
out to explore parametric influences.
Results show that a gold platted ring reflector
can effectively compensate radiation heat
losses. A ring reflector with properly regional
platted can reduce temperature variation
down to a few degrees.
Subjects
rapid thermal processing
transient
flow
flow
thermal radiation
mixed convection
Publisher
臺北市：國立臺灣大學應用力學研究所
Type
report
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