Intermetallic Compounds Formed during the Reflow and Aging of Sn-3.8Ag-0.7Cu and Sn-20ln-2Ag-0.5Cu Solder Ball Grid Array Packages

Journal

Journal of Electronic Materials

Journal Volume

33

Journal Issue

3

Pages

171-180

Date Issued

2004

Author(s)

Cheng, M.D.

Yen, S.F.

Yen, S.F.

Chuang, T.H.

TUNG-HAN CHUANG

DOI

10.1007/s11664-004-0176-9

URI

https://scholars.lib.ntu.edu.tw/handle/123456789/492020

URL

https://www.scopus.com/inward/record.uri?eid=2-s2.0-1842584333&doi=10.1007%2fs11664-004-0176-9&partnerID=40&md5=78442b7a99f4309ba144e86602947a87

Type

journal article