Semiconductor Equipment Monitor ing and Preventive Maintenance
Date Issued
2000
Date
2000
Author(s)
DOI
892212E002041
Abstract
In semiconductor fabrication processes, the value added
on each wafer in every process step is increasing drastically
as we enter the era of 300mm wafer processing. Wafer
Acceptance Test (WAT) and post-process engineering data
measurement and analyses are no longer sufficient to fulfill
the urgent need of achieving a higher equipment yield. Realtime
monitoring of equipment conditions becomes critical to
keep a closer watch on wafer processing and to give early
warning on possible equipment excursions. Accurate,
effective equipment monitoring is also essential to ensure a
high availability and thus a high overall equipment
effectiveness. The objective for the second year of this
project is to propose a dynamic PM scheduling plan. Since
the equipment monitoring is in real time and the system’s
health is constantly evaluated, an equipment reliability model
with constant updates can be constructed. Based on the
accurate prediction of the equipment reliability, the PM
schedule can be planned more dynamically and proactively.
An effective PM scheduling plan is, thus, developed to
maximize the equipment’s availability by eliminating
unnecessary maintenance and to minimize the equipment’s
down time by providing needed maintenance before failures
occur. This will, in turn, greatly enhance the Overall
Equipment Effectiveness (OEE).
Subjects
Equipment Monitoring
Preventive Maintenance
Publisher
臺北市：國立臺灣大學工業工程學研究所
Type
report
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892212E002041.pdf
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Format
Adobe PDF
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