A novel method for measuring thick film thermal conductivity
Journal
2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems
Pages
1052-1056
Date Issued
2010
Author(s)
Abstract
We describe a novel method to measure the thermal conductivity of thick films. Based on the analytical solution of a comprehensive 2-D film-substrate heat diffusion problem, we derived a simple empirical solution for determination of the thick-film thermal conductivity. We use the negative photoresist SU-8 as a thick film material, the use of lithography process and a simple instrument that can be obtained from the measurement system, allowing measurements of SU-8 thick-film thermal conductivity coefficient of 0.21 W / mK. The results with the SU-8 record of the thermal conductivity coefficient (0.2 W / mK) is very similar. It is also establishes the feasibility of the measurement method.
SDGs
Type
conference paper