Formation and resettlement of (AuxNi1-x)Sn4 in solder joints of ball-grid-array packages with the Au/Ni surface finish

Journal

Journal of Electronic Materials

Journal Volume

29

Journal Issue

10

Pages

1175-1181

Date Issued

2000

Author(s)

Ho C.E.

Zheng R.

Luo G.L.

Lin A.H.

DOI

10.1007/s11664-000-0010-y

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-0034295436&doi=10.1007%2fs11664-000-0010-y&partnerID=40&md5=8c6a57a06158fc9d48d529375de7fa8d

https://scholars.lib.ntu.edu.tw/handle/123456789/432745

Publisher

Minerals, Metals & Materials Soc (TMS), Warrendale

Type

journal article