Copper-Holmium Alloy Film for Reliable Interconnects

Resource

Japanese Journal of Applied Physics, 49(5), 05FA03

Journal

Japanese Journal of Applied Physics

Journal Volume

49

Journal Issue

5

Pages

-

Date Issued

2010

Date

2010

Author(s)

Lin, Chon-Hsin

Leau, Wen-Kuan

Wu, Cheng-Hui

DOI

URI

Type

journal article

File(s)

Name

336.pdf

Size

23.37 KB

Format

Adobe PDF

Checksum

(MD5):6a4c10ea5d94d0015d1841fa59b03c73