Wireless inter-chip signal interconnect using vertical coupled inductors for 3D-IC applications
Date Issued
2008
Date
2008
Author(s)
Wu, Guan-Ming
Abstract
A wireless interconnect for 3D-IC applications is implemented by using coupled inductor filter design. Inductive coupling interconnect has longer communication distance to 30μm as compared with capacitive interconnect. The longer distance means that it can resist the alignment mismatches and increase the yields for packaging. We use ASK modulation technique to transmit the data. In transmitter, a PLL is used as the local oscillator, and switches are used as passive mixer. In receiver, rectifiers are used to demodulate received signal, and cascaded limiters amplify the signal. This method has energy efficiency to 6.77pJ/bit at 3.5Gbps. The proposed wireless interconnect is implemented in TSMC 0.18μm process for demonstration of this architecture.
Subjects
3D-IC
coupled inductor
ASK modulation
PLL
passive mixer
rectifier
SDGs
Type
thesis
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ntu-97-R95943097-1.pdf
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