Thermal stability of grain structure and material properties in an annealing twinned Ag-4Pd alloy wire
Journal
Journal of Alloys and Compounds
Journal Volume
615
Pages
891-898
Date Issued
2014
Author(s)
Chuang, T.-H.
Lin, H.-J.
Chuang, C.-H.
Shiue, Y.-Y.
Shieu, F.-S.
Huang, Y.-L.
Hsu, P.-C.
Lee, J.-D.
Tsai, H.-H.
Abstract
An annealing twinned Ag-4Pd binary alloy wire has been produced as an alternate material for a previously developed Ag-8Au-3Pd ternary alloy wire to meet requirements for high electrical conductivity and low cost. The electrical resistivity of this annealing twinned Ag-alloy bonding wire decreased drastically from the original value of 3.5 μΩ cm to about 2.9 μΩ cm after aging at 600 °C for 30 min. The decrease in electrical resistivity became moderate with longer aging times. In contrast to the apparent increase in grain size in a conventional Ag-4Pd wire during aging at 600 °C for various times, the grains in this annealing twinned wire grew much more slowly. The breaking load and elongation of this annealing twinned Ag-4Pd wire are also higher than those of conventional wire. The conventional grained Ag-4Pd wire has a slightly higher electrical resistivity of 3.7 μΩ cm than that of annealing twinned wire. However, the more rapid grain growth in the conventional grained Ag-4Pd wire led to a lower electrical resistivity than that of annealing twinned wire during aging process. © 2014 The Authors. Published by Elsevier B.V.
SDGs
Type
journal article