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無鉛銲錫球格陣列構裝製程與可靠度分析─子計畫一:無鉛銲錫球格陣列構裝接點之冷熱循環與動態疲勞分析
Date Issued
2001
Date
2001
Author(s)
DOI
892216E002056
Abstract
In this study, we do temperature
cycling tests for BGA package. The
lead-free solder in this study includes
Sn-3.5Ag and Sn-57Bi comparable with
Sn-37Pb. This test follows the JEDEC
STANDARD “JESD22-A104-B” and
then we process the ball shear test that
we can understand the strength change
of the joints. The result appears that the
strength of these solders decrease by
increasing the test cycles. In each
different circles of test, the Sn-3.5Ag
solder keep the highest strength and
Sn-37Pb solder is the lowest one. After
1000 cycles, the morphology of the
fractured surface find that the solder
joints of Sn-37Pb and Sn-5Bi break up
in the intermetallic compounds, but
Sn-3.5Ag solder fractured in the solder
after one thousand cycles .
cycling tests for BGA package. The
lead-free solder in this study includes
Sn-3.5Ag and Sn-57Bi comparable with
Sn-37Pb. This test follows the JEDEC
STANDARD “JESD22-A104-B” and
then we process the ball shear test that
we can understand the strength change
of the joints. The result appears that the
strength of these solders decrease by
increasing the test cycles. In each
different circles of test, the Sn-3.5Ag
solder keep the highest strength and
Sn-37Pb solder is the lowest one. After
1000 cycles, the morphology of the
fractured surface find that the solder
joints of Sn-37Pb and Sn-5Bi break up
in the intermetallic compounds, but
Sn-3.5Ag solder fractured in the solder
after one thousand cycles .
Subjects
JEDEC STANDARD
temperature cycling tests
lead-free solder
Publisher
臺北市:國立臺灣大學材料科學與工程學研究所
Coverage
計畫年度:89
第二期;起迄日期:2000-08-01/2001-07-31
第二期;起迄日期:2000-08-01/2001-07-31
Type
report
File(s)
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Name
892216E002056.pdf
Size
185.49 KB
Format
Adobe PDF
Checksum
(MD5):49deb0efda34c01b445c5fe6b598c16d