In-Situ Observation of Material Migration in Flip-Chip Solder Joints under Current Stressing

Resource

Journal of Electronic Materials 35 (10): 1781-1786

Journal

Journal of Electronic Materials

Journal Volume

35

Journal Issue

10

Pages

1781-1786

Date Issued

2006

Date

2006

Author(s)

Tsai, C.M.

Lai, Yi-Shao

Lin, Y.L.

Chang, C.W.

Kao, C.R.

URI

Type

journal article

File(s)

Name

02.pdf

Size

429.17 KB

Format

Adobe PDF

Checksum

(MD5):acce0a21abc6c1c75a2efb29dc720bb9