Longitudinal Patent Analysis for Chemical Mechanical Polishing Pad
Date Issued
2010
Date
2010
Author(s)
Kao, Ching-Yin
Abstract
As the feature sizes of Integrated Circuits continue to shrink, the ability to globally planarize the wafer surface becomes increasingly important. The Chemical Mechanical Polishing or Planarization (CMP) is regarded as the most successful planarization process in IC fabrication. CMP has the capability to achieve global planarization of interlayered dielectrics and metal films and its relative cost-effectiveness. The CMP Pad is one of the most important consumables in CMP and has a critical effect on achieving controlled material removal and uniformity. The objective of this study is to learn the CMP Pad development trend by using patent analysis first, including the number of patents, countries, companies, industries and technical classifications. Second, it’s to learn the CMP Pad technological knowledge spillover and flow by using patent citation analysis, including the countries, companies, industries and technical classifications.
Achievement of this study includes the following items: (1) USA is the leading country of CMP Pad technologies. (2) Rohm & Haas Co. is the leading company of CMP Pad technologies. (3) The Semiconductors and Related Devices industry （3674）published the most CMP Pad patents. (4) The CMP Pad technologies are focused on B24B and B24D of IPC, B24B 37/04 especially. (5) There is the geographic localization of knowledge spillover on the patent citations in US. (6) There are two-way knowledge flows among US, JP, TW and KR, between US and JP especially. (7) There are two-way knowledge flows among Rohm & Haas Co., Micron Technology, Inc., Applied Materials, Inc. and IBM Corp.. (8) There are two-way knowledge flows between Taiwan Semiconductor Manufacturing Co., Ltd. and Applied Materials, Inc., United Microelectronics Corp. and Applied Materials, Inc., Macronix International Co., Ltd. and Applied Materials, Inc.. (9) There are two-way knowledge flows among 7379, 3674 and 2821 SIC; 3559, 3674 and 3663 SIC; 3559, 3674 and 7379 SIC; 3559, 3674 and 2821 SIC. (10) There are two-way knowledge flows among B24B 37/04, B24D 3/20 and B24D 7/12 IPC; B24B 37/04, B24D 3/20 and B24D 3/34 IPC.
Subjects
patent
patent citation
Chemical Mechanical Polishing
CMP
CMP Pad
knowledge spillover
knowledge flow
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