Origin and evolution of voids in electroless Ni during soldering reaction

Journal

Acta Materialia

Journal Volume

60

Journal Issue

11

Pages

4586-4593

Date Issued

2012

Author(s)

Chung C.K.

Chen Y.J.

Chen W.M.

DOI

10.1016/j.actamat.2012.02.018

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-84862805862&doi=10.1016%2fj.actamat.2012.02.018&partnerID=40&md5=de70e87230b082b5f2cc8094e6ddd74a

https://scholars.lib.ntu.edu.tw/handle/123456789/432637

Type

journal article