Intermetallic Compounds Formed during the Reflow and Aging of Sn-3.8Ag-0.7Cu and Sn-20In-2Ag-0.5Cu Solder Ball Grid Array Packages

Resource

Journal of Electronic Materials 33 (3): 171-180

Journal

Journal of Electronic Materials

Journal Volume

33

Journal Issue

3

Pages

171-180

Date Issued

2004

Date

2004

Author(s)

Cheng, M. D.

Chang, S. Y.

Yen, S. F.

Chuang, T. H.

URI

Type

journal article

File(s)

Name

87.pdf

Size

810.22 KB

Format

Adobe PDF

Checksum

(MD5):0f7912becd708799c6c592d3e4079dad